PENGARUH KONSENTRASI TEMBAGA DAN RAPAT ARUS TERHADAP MORFOLOGI ENDAPAN ELEKTRODEPOSISI TEMBAGA

Soleh Wahyudi, Syoni Soepriyanto, M. Zaki Mubarok, Sutarno Sutarno

Abstract


Abstract:. Copper deposits have been obtained by the electrolysis method using copper sulfate and sulfuric acid. The effect of copper concentration and current density on the surface morphology of copper deposits and current efficiency have been studied. The variation of copper concentration is 0.04 M and 0.8 M and the variation of current density is 2-8 A/dm2. The copper deposits will be photographed macro, weighed and characterized by Scanning Electron Microscope (SEM) to determine the surface morphology of deposits and Energy-Dispersive X-ray spectroscopy (EDX) to determine the chemical composition of deposits. The surface morphology of copper deposits in the form of compact and without nodules was reached at copper concentration is 0.8 M and the current density is 2 A/dm2 with the average of current efficiency is 96%.

Keyword: Electrodeposition, copper, morphology, compact, current efficiency

Abstrak: Endapan tembaga telah dihasilkan dengan metode elektrolisis menggunakan bahan tembaga sulfat dan asam sulfat. Penelitian ini mempelajari pengaruh konsentrasi tembaga dan rapat arus terhadap morfologi permukaan endapan tembaga dan efisiensi arus. Variasi konsentrasi tembaga adalah 0,04 M dan 0,8 M sedangkan variasi rapat arus adalah 2-8 A/dm2. Endapan tembaga yang dihasilkan akan difoto makro, ditimbang berat lapisannya dan diuji karakteristiknya dengan Scanning Electron Microscope (SEM) untuk mengetahui detail morfologi permukaan endapan dan Energy-Dispersive X-ray spectroscopy (EDX) untuk mengetahui komposisi kimia endapan. Morfologi permukaan endapan tembaga berbentuk compact dan tanpa nodul tercapai pada kondisi konsentrasi Cu 0,8 M dan rapat arus 2 A/dm2 dengan efisiensi arus mencapai rata-rata 96%.

Kata Kunci: Elektrodeposisi, tembaga, morfologi, compact, efisiensi arus

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References


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DOI: https://doi.org/10.31848/ensains.v2i3.295

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